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Dongguan Ziitek Electronical Material and Technology Ltd.
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High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling

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High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling

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Brand Name : Ziitek

Model Number : TIS800

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/pcs

Delivery Time : 3-6 work days

Packaging Details : 24*23*12CM

Product name : High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling

keyword : Heat Conduction Insulating Gasket

Application : Chip heat sink,Semiconductor Device Cooling

continous use temp : -45 to 180℃

compliance : UL & RoHS

Materials : Ceramic filled silicone elastomer / Fiberglass

Feature : Low thermal resistant with high voltage isolation

Thermal conductive : 1.6W/mK

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High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

The TIS™800 Series is acomposite of silicone rubber and fiberglass .Thematerial is flame retardant and is specially formulated for use asa thermakky conductive insulator,The primary use for TIS800 isto electrically isolate power sources from heat sinks.TIS 800 hasexcellent mechanical and physical characteristics.Surfaces arepliable and allow complete surface contact with excellent heat.

TIS800-Series-Datasheet (1).pdf


Features:
> Highly compliant surface characteristic with high thermal conductivity
> High thermal conductive and High dielectric strength
> Low thermal resistance with high voltage isolation
> Resistant to tears and punctures


Applications:
> Power conversion equipment
> Power semiconductors:To packages, MOSFETs & IGBTs
> Audio and Video components
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components

Typical Properties of TIS™800 Series
Product Name TIS800 Test Method
Color Gray Visual
Construction &Compostion Ceramic filled silicone elastomer /fiberglass ******
Thickness range 0.127mm-0.457mm ASTM D751
Hardness 65 Shore A ASTM 2240
Specific Gravity 2.2 g/cc ASTM D297
Tensile Strength >1500 psi ASTM D412
Continuos Use Temp -45 to 180℃ ***
Dielectric Breakdown Voltage >1500 VAC ASTM D149
Dielectric Constant 5.5 MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 1.6 W/m-K ASTM D5470

Product Thicknesses

TIS 805: 0.127mm

TIS 806: 0.152mm

TIS 808: 0.203mm

TIS 810: 0.254mm

TIS 812: 0.304mm

TIS 818: 0.457mm

Product Sizes
8" x 160"(203mm x 48.76M)

Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on doule side with "A2" suffix.

Reinforcement:
TIS™ series sheets are fiberglass reinforced.

High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling

Packaging Details & Lead time

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Independent R&D team

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A:1. Click the "Sent messages" button to continue with the process.

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This message should include any questions you might have about the products as well as your purchase requests.

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4. We will reply you as soon as possible with Email or online.


Product Tags:

fiberglass insulation heat resistance

      

thermal insulation sheet

      

Chip Heat Sink Thermal Insulation Sheet

      
Best High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling wholesale

High Performance Heat Conduction Insulating Gasket For Semiconductor Device Cooling Images

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