PCM Phase Change Material For Communications Equipment And Wireless Stations
The TIC™800P Series is low melting point thermal interface material. At 50℃, The TIC™800P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.
TIC™800P Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™800P Series shows no thermal performance degradation after 1,000 hours@130℃,or after 500 cycles, from -25℃ to 125℃.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
TIC800P-Series-Datasheet.pdf
Features
> 0.024℃-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
| Typical Properties of TIC™800P series |
| Product Name | TIC™805P | TIC™806P | TIC™810P | Test Method |
| Color | Pink | Visual |
| Thickness | 0.005"/0.126mm | 0.008"/0.203mm | 0.010"/0.245mm | ****** |
| Thickness Tolerance | ±0.0008"/±0.0019mm | ±0.0008"/±0.0019mm | ±0.0012"/±0.030mm | ****** |
| Specific Gravity | 2.2 g/cc | Helium Pycnometer |
| Temperature range | -25 to 125℃ | ****** |
| Phase Change Softening Temperature | 50℃-60℃ | ****** |
| Thermal conductivity | 0.95W/mK | ASTM D5470 |
| Thermal Impedance@50psi | 0.24℃-in²/W 0.15℃-cm²W | 0.053℃-in²/W 0.34℃-cm²W | 0.080℃-in²/W 0.52℃-cm²W | ASTM D5470 |
Standard Thicknesses:
0.005"(0.127mm) , 0.008"(0.203mm) , 0.010"(0.254mm)
Consult the factory alternate thickness.
Standard Sizes:
10" x 16"(254mm x 406mm) 16" x 400'(406mm x 121.92M)
TIC™800 series are supplied with a white release paper and a bottom liner. TIC™800 series is available in kiss cut an extended pull tab liner or individual die cut shapes.
Peressure Sensitive Adhesive:
Peressure Sensitive Adhesive is not applicable for TIC™800 series products.
Reinforcement:
No reinforcement is necessary.
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
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